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High Quality Products Seoul International Chemical
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Process of the PCB | Process application | Product name | |||
New development items | H2SO4 Base Cleaner | SC-152AD / High-efficiency electro kinetic degreasing | |||
H2SO4 + H2O2 Type Soft Etching | SIC-3200 / High-level etching | ||||
Horizontal line desmear | SIC-110C / High TG | ||||
Ethant | SPS Type Soft Etching | SIC-125 | |||
Formic acid Type Soft Etching | SIC-2200 | ||||
Desmear Process | Sweller | SIC-110A | |||
Epoxy Etching | 40% Sodium permanganate | ||||
Neutralizer | SIC-140 | ||||
PTH( Electroless Cu Plating ) |
| <Ion>
| <Colloid>
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Cleaning | SIC-215 | SIC-2101 | |||
Pre-dip | SIC-230 | SIC-2301 | |||
Catalyst | SIC-240 | SIC-2401 | |||
Reducer | SIC-250 | SIC-2501 | |||
Electroless Cu Plating | SIC-260/360 | SIC-260/360 | |||
Pre Maintenance Chemical | PSR Develop M/C Cleaning | SC-156PM | |||
| Dry Film M/C Cleaning | SC-165DPM | ||||
treatment Step | Function | Processing time | Management point | Remarks |
Acid cleaner | Dip treatment, warming function | 3min | 42℃ | 250*750*800(h) = approximately 150ℓ |
Water washing | Dip treatment | 45sec | Ordinary temperature | 250*750*800(h) = approximately 150ℓ Mass production facility Washing 4 levles (First 2 dips, Second 2 sprays) |
Sulfuric acid | Dip treatment | 45sec | 10% density | 250*750*800(h) = approximately 150ℓ |
copper plating | Horizontal swing, insoluble anode | 60min | 18㎛ plated | ※ 3.8V*150A * 60(min) apply condition |
